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 CED9926/CEU9926
PRELIMINARY
N-Channel Logic Level Enhancement Mode Field Effect Transistor
FEATURES
6
20V , 26A , RDS(ON)=30m @VGS=4.5V. RDS(ON)=40m @VGS=2.5V. Super high dense cell design for extremely low RDS(ON). High power and current handling capability. TO-251 & TO-252 package.
D G S
G D S
D
G
CEU SERIES TO-252AA(D-PAK)
CED SERIES TO-251(l-PAK)
S
ABSOLUTE MAXIMUM RATINGS (Tc=25 C unless otherwise noted)
Parameter Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous -Pulsed Drain-Source Diode Forward Current Maximum Power Dissipation @Tc=25 C Derate above 25 C Operating and Storage Temperature Range Symbol VDS VGS ID IDM IS PD TJ, TSTG Limit 20 12 26 78 26 38 0.25 -55 to 175 Unit V V A A A W W/ C C
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient R JC R JA
6-82
4 50
C/W C/W
CED9926/CEU9926
ELECTRICAL CHARACTERISTICS (TC= 25 C unless otherwise noted)
Parameter OFF CHARACTERISTICS
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage BVDSS IDSS IGSS VGS(th) RDS(ON) ID(ON) gFS
b
Symbol
Condition
VGS = 0V, ID=250A VDS = 20V, VGS = 0V VGS = 12V, VDS = 0V VDS = VGS, ID = 250A VGS = 4.5V, ID = 8A VGS = 2.5V, ID = 6.6A VDS = 5V, VGS = 4.5V VDS = 10V, ID = 8A
Min Typ Max Unit
20 1 100 0.5 1.5 30 40 26 15 500 V A nA V m m A S
C
4
6
ON CHARACTERISTICS a
Gate Threshold Voltage Drain-Source On-State Resistance On-State Drain Current Forward Transconductance
DYNAMIC CHARACTERISTICS
Input Capacitance Output Capacitance Reverse Transfer Capacitance
CISS COSS CRSS
b
PF PF PF
VDS =15V, VGS = 0V f =1.0MHZ
300 140
SWITCHING CHARACTERISTICS
Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
tD(ON) tr tD(OFF) tf Qg Qgs Qgd
VDD = 10V, ID = 1A VGS = 4.5V, RGEN =6 VDS = 10V,ID = 8A VGS = 4.5V
20 18 60 28 10 2.3 2.9
40 40 108 56 15
ns ns ns ns nC nC nC
6-83
CED9926/CEU9926
ELECTRICAL CHARACTERISTICS (TC=25 C unless otherwise noted)
Parameter
Diode Forward Voltage
Symbol
VSD
Condition
VGS = 0V, Is = 4A
Min Typ Max Unit
1.3 V
DRAIN-SOURCE DIODE CHARACTERISTICS a
6
Notes a.Pulse Test:Pulse Width 300 s, Duty Cycle 2%. b.Guaranteed by design, not subject to production testing.
30 VGS=4.5,3.5,3V 25 VGS=2.5V 12 15
ID, Drain Current (A)
20 15 VGS=2V 10 5 0 0 1 2 3 4
ID, Drain Current (A)
9
6 25 C 3 Tj=125 C 0.5 1 1.5 -55 C 2 2.5
VGS=1.5V
0
VDS, Drain-to-Source Voltage (V)
VGS, Gate-to-Source Voltage (V)
Figure 1. Output Characteristics
RDS(ON), Normalized RDS(ON), On-Resistance(Ohms)
1000
Figure 2. Transfer Characteristics
2.2 1.9 1.6 1.3 1.0 0.7 0.4 -100 -50 0 50 100 150 200
ID=8A VGS=4.5V
800
C, Capacitance (pF)
600 400
Ciss
Coss 200 Crss
0 0 5 10 15 20
VDS, Drain-to Source Voltage (V)
TJ, Junction Temperature( C)
Figure 3. Capacitance
Figure 4. On-Resistance Variation with Temperature
6-84
CED9926/CEU9926
BVDSS, Normalized Drain-Source Breakdown Voltage Vth, Normalized Gate-Source Threshold Voltage
1.30 1.20 1.10 1.00 0.90 0.80 0.70 0.60 -50 -25 0 25 50 75 100 125 150 1.15 ID=250 A 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25
VDS=VGS ID=250 A
6
0 25 50 75 100 125 150
Tj, Junction Temperature ( C)
Tj, Junction Temperature ( C)
Figure 5. Gate Threshold Variation with Temperature
20
Figure 6. Breakdown Voltage Variation with Temperature
50
gFS, Transconductance (S)
Is, Source-drain current (A)
16 12 8 4 VDS=10V 0 0 3 6 9 12
10
1.0
0.1 0.6 0.8 1.0 1.2 1.4
IDS, Drain-Source Current (A)
VSD, Body Diode Forward Voltage (V)
Figure 7. Transconductance Variation with Drain Current
5
Figure 8. Body Diode Forward Voltage Variation with Source Current
2
VGS, Gate to Source Voltage (V)
ID=8A VDS=10V
10
ID, Drain Current (A)
4 3 2 1 0 0 3 6 9 12
10
1
R
( DS
ON
)Li
mi
t
1s 10s
10ms
100ms
10 0
-1
DC
10
10
-2
TA=25 C R JA=50 C/W Single Pulse 10 0 10 1 10
2
10 -1
Qg, Total Gate Charge (nC)
VDS, Drain-Source Voltage (V)
Figure 9. Gate Charge 6-85
Figure 10. Maximum Safe Operating Area
CED9926/CEU9926
4
V IN D VGS VDD t on RL VOUT VOUT RGEN G
90% 10%
toff tr
90%
td(on)
td(off)
90% 10%
tf
INVERTED
6
S
VIN
50% 10%
50%
PULSE WIDTH
Figure 11. Switching Test Circuit
Figure 12. Switching Waveforms
10
0
r(t),Normalized Effective Transient Thermal Impedance
D=0.5 0.2 10
-1
0.1 0.05 0.02 PDM t1 0.01 t2 1. R JC (t)=r (t) * R JC 2. R JC=See Datasheet 3. TJM-TC = P* R JC (t) 4. Duty Cycle, D=t1/t2 10
-2
10
-2
Single Pulse
-3
10
10
-4
10
-3
10
-1
10
0
10
1
10
2
Square Wave Pulse Duration (sec)
Figure 13. Normalized Thermal Transient Impedance Curve
6-86


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